TPT Wire Bonder Co. manufactures manual and semi-automatic wire bonder with over 30 years of experience in wire bonding and die bonding technology.

Semi-automatic wire bonder with motorized Z- and Y-axes, used to create electrical interconnects between dies and packages/printed circuit boards.

TPT HB05 Wire Bonder Before use, the bonder must be enabled in Coral. This will power up the bonder, LED illuminator, camera, and monitor. General Guidelines for Use The bonder can be configured for aluminum or gold wire bonding. Each uses its own spool and bond tool(s). Ball bonding can also be performed with gold wire.

GENERAL INFORMATION. This new semi-auto wire bonder is capable of Ball (15-50um), Wedge (17-75um), Bump, and Ribbon (max 25x250um) Bonding.

Manufacturer of Manual Wire Bonders,Semi-Auto Wire Bonders,Full-Auto Wire Bonders. TPT Wire Bonders, ASM Wire Bonders.bonder,wire bonder,wire bonding 

TPT Wire Bonder is an owner-managed company that manufactures wire and die-bonders and is represented in over 60 countries worldwide.

TPT HB16 Wire bonder Description Semi-automatic wire bonder with motorized Z- and Y-axes, used to create electrical interconnects between dies and packages/printed circuit boards. Features Capable of ball, wedge, bump, and ribbon bonding 17 µm to 75 µm wire thickness, gold or aluminum wire Motorized Y- & Z-axis, manual X-axis

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TPT Wire Bonders. HB10 Wire Bonder with motorized Z-Axis. The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines. One bond Head for Bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT touchscreen, direct access and simple adjusment of all bond

TPT Wirebonder www.tpt.de. Page 6 of 53. September 2016. 5. Introduction. The HB XX ultrasonic wire bonder is characterized by vertical feed of wire or 

Sep 10,  · Early , Nano Vacuum installed a TPT - HB10 Wire Bonder (Germany) at School of Chemical Engineering, University of New South Wales. The HB10 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary.