A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, 

A two-step high bottleneck type capillary for a wire bonding device having a height of 1.5˜5.0 mm and taper of 10˜15° from the capillary end is disclosed.

capillary solution for advanced memory & logic devices TeraCap™ is the latest capillary series for advanced memory and logic devices packaging using either gold or silve wire. TeraCap™ Major Benefits: Excellent bonding and looping consistency (yield) Superior workability (MTBA - more bonds per hour) Extended durability (more bonds per capillary)

② Long life capillaries keep their initial wire-bond pull-strengths and process window settings for longer periods of time. This provides more lasting bond 

the selection of capillary part number process is simplified as follows: capillary tip the selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter (hd), chamfer diameter (cd), chamfer angle (ca),

The loop profile significantly influences the reliability of wire bonding, and it is necessary to study the wire bond looping process. The loop profile of the bonding wire is determined by the tension and material property of bonding wire as well as the trace and structure of capillary, in which the capillary trace has a major impact on the

Capillaries are high precision manufactured, with attributes specific to the wire diameter in use and bonding process parameters. Capillaries are manufactured from two main materials: Toughened Alumina. ATLAS (very high mechanical strength Alumina) The figure below describes the K&S capillary nomenclature: There are many factors to consider

Wire diameter is a key factor in determining the appropriate hole size of the capillary. An optimal hole size is essential for a successful 

For Bond capillaries, various selected refined materials are available: for example, alumina, zirconia toughened alumina, and tungsten carbide. Bump Video. Read 

Capillaries with tighter tolerance control and improved ceramic materials are necessary because the capillary tip diameter is extremely small for very fine 

Capillaries are tools used in wire bonding machines to connect IC chip electrodes and lead terminals with wires. Our company designs capillaries according to bonding specifications,